Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
90º Side-view Optical Inspection System
Advanced systems for side-view optical inspections of BGA, μBGA. FipChip, CSP, CGA solder bumps
Premium imaging quality for fast and flexible inspection, measurement and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and SMD components.
Inspectis BGA Inspection System ProX
High-resolution 5.0MP digital inspection system with super-speed USB3.0 interface. All included extensive system package powered by INSPECTIS© ProX software for reliable and fast side-view and top-view optical inspection, measurement and documentation of hidden solder joint of BGA, μBGA. FipChip, CSP, CGA and SMD components.
Inspectis BGA Inspection System Basics
High-resolution 5.0MP digital inspection system with super-speed USB3.0 interface. Cost effective package powered by INSPECTIS© Basics software for reliable and fast side-view optical inspection, measurement and documentation of hidden solder joint of BGA, μBGA. FipChip, CSP and CGA.
