Optical BGA Inspection System ProX

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Premium BGA Solder Joints Inspection

Superior Optical Performance

New generation side-view optical BGA inspection system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components. Variable focus capability of the optics with a flexible, electronically dimmable incident microprism and background fiberoptics lightings allows the user to image from first to up to 20 rows of BGA solder bumps.

Powered by INSPECTIS© ProX

Powerful still easy-to-use software providing tools for live image view, advance camera control, image/video/audio capture, geometrical measurements, image overlays and comparison, focus stacking, annotations and reporting among other features.

Developed for Productivity

High resolution optics coupled with high-power LED lighting system, robust optical probe and fast USB3.0 camera interface produces clear, crisp and high frame-rate real-time video of the hidden solder joints.

Robust

Reliable

Easy to Use

Advanced, Flexible and Reliable system

Variable focus capability of the optics allows the user to image from first to up to 20 rows of BGA solder bumps with its flexible, electronically dimmable fibre brush light as background illumination.

5.0Mp USB3.0 digital camera with custom-designed optics creates bright images of hidden solder joints down to 40 microns stand-off.

Robust Desgin for Ease-of-Use

Rigid stand with course/fine axial alignment, large base and precision xy-stage. A unique soft-touch mechanism design in the stand bracket protects the micro-prisms in the optical probe tip from damage when positioned on surface of the inspection PCB.

Integrated micro-prism and soft fiber-brush background light with electronic dimmer.

180º pivoting mechanism for easy alignment of the probe along 3 different sides of the BGA package.

Dedicated Software

The system is supplied with INSPECTIS© software. Powerful yet easy-to-use live image view, capture, analysis, utility, and metrology software. INSPECTIS© BGA ProX provides powerful tools for calibration of magnification, live image overlays, comparison, focus stacking, image stitching, annotations and reporting.

Available in two functionality levels, INSPECTIS© Basics and INSPECTIS© ProX for side-view BGA and top-view PCB optical inspection.

Explore INSPECTIS© software

Data Export, Report and Certificate

Software includes a report and certificate generator with user-defined templates. Measurement data and comments are automatically imported with selected images.

Data table is generated automatically and linked to the measured image and printed in Report. Results can also be exported to Excel or other programs.

Flexible and Versatile Inspection System

Thanks to its interchangeable side-view and top-view optics the Inspectis optical BGA inspection system provides a flexible and versatile inspection solution for efficient use of investment budget for all post-production or R&D optical inspetion tasks.

Explore BGA Lenses & Probes

Included items when you order BGA-002

Digital Microscope, 5MP, USB3.0 interface
INSPECTIS© ProX BGA Inspection software
Inspectis interchangeable 90º side-view BGA inspection lens
Inspectis interchangeable 80x top-view varifocal lens
Fiber Optics Background Light with High-power LED and electronic dimmer
Microprism Background Light with LED light source
Stand with Rack&Pinion, soft-touch and pivoting bracket for BGA microscope
Precision XY-stage with antistatic mat and magnetic pegs (4x)
Aluminum Carying Case for Digital Microscope and BGA lens
Inspectis USB Foot switch for INSPECTIS© Software, 1-pedal
Annual Service and Support for INSPECTIS© software (one year)

Downloads

Brochure_Inspectis BGA Inspection

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Data sheet_Inspectis BGA Lenses and Optical Probes

Download Data Sheet

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Sample-report-BGA-inspection

Download Sample Report

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Inspectis Product Catalogue

Product video

Specifications

System

Imager	1/2.5” CMOS, Colour 5 million Pixels.
Pixel Size / Resolution	2.2 μm x 2.2 μm / 2592(H) x 1944(V) pixels
Interface	USB3.0 / USB3.1 Gen 1 (backwards compatible with USB 2.0)
Video Formats @ Frame Rate	2592×1944 (5 MP) @15fps, 2000×1500 (3MP)@24fps, 1920×1080 (Full HD)@30fps
Digital Camera Control	Auto/Manual Exposure, Frame Stacking, Contrast, Brightness, Gamma, Sharpness, High Dynamic Range, Auto/Manual White Balance, Flip H, Flip V.
Software	INSPECTIS© BGA ProX with direct digital camera control
Preset/Recall Memories	2 factory set and 2 user definable with quick access buttons.
Preset/Recall calibrated magnifications	5 factory set and 10 user-definable calibrated magnifications with quick access buttons.
Image Capture	Snap switch on device, foot-pedal or by software
Video & Audio Capture format	JPG, PNG, AVI
Mount	UNC 1/4″–20
Illumination	Incident LED light + micro-prism background light LED + fiber-optics brush light (goose-neck) LED. Electronic light intensity control.
Stand	Large base antistatic coated stand with coarse/fine precise axial rack&pinon movement, ±90° pivoting function and soft-touch probe protection mechanism.
XY-Stage	Precision XY-board, 50x50mm travel range with micrometre drive. Antistatic protected. Freely movable on the stand base.
Storage / Operating Environment	-20° – +60°C / -5 ° – +40°C, 20 – 95% RH, non-condensing
Size / Weight: ProX System	470(L) x 350(W) x 385(H) mm / ~14 kg. including XY-stage
Antistatic design	ESD protected with GND connection points on stand bracket and XY-stage

Optics: (Side-view BGA lens)

Magnification	~ 25x – 200x on 24” monitor (on-screen magnification)
Working distance	~ 0.5 – 30 mm (focusing range)
Illumination	Built-in high-power pure white LED light source through microprisms
Footprint of standard size probe	0.85 x 6.6mm on PCB (~ 1mm free area around IC package is required)

Optics: (Top-view 8-80x lens)

Lens system	~ 8x – 80x on 24” monitor (on-screen magnification)
Working distance	~ 10 – 150 mm
Illumination	Built-in pure white LED ring-light with holographic diffuser
Size	D29 x 36 (L) mm

Optional accessories

Interchangeable 90° side-view small size optical probe

Item no. BGA-007

Optical probe for Inspectis side-view BGA inspection lenses. Robust design, made of stainless steel including specially high resolution optics and light guides. Create bright images of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA components down to 40 microns stand-off.

Thickness of optical probe: 1.5 mm
Width of optical probe: 6.0 mm
Foot print of optical probe: O.7 x 6.0 mm
Required free working area: ~ 0.8 mm

This item can be ordered as an extra probe for standard BGA lens or as spare part.

Download data sheet