Premium BGA Solder Joints Inspection
Superior Optical Performance
New generation side-view optical BGA inspection system, designed for fast and flexible optical inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components. Variable focus capability of the optics with a flexible, electronically dimmable incident microprism and background fiberoptics lightings allows the user to image from first to up to 20 rows of BGA solder bumps.
Powered by INSPECTIS© ProX
Powerful still easy-to-use software providing tools for live image view, advance camera control, image/video/audio capture, geometrical measurements, image overlays and comparison, focus stacking, annotations and reporting among other features.
Developed for Productivity
High resolution optics coupled with high-power LED lighting system, robust optical probe and fast USB3.0 camera interface produces clear, crisp and high frame-rate real-time video of the hidden solder joints.