Side-view Optical System for BGA Inspection
Superior Optical Performance
New generation side-view BGA inspection system, designed for easy and flexible inspection, analysis and documentation of hidden solder joints of BGA, μBGA. FipChip, CSP, CGA and top-view SMD components.
Powered by INSPECTIS© Basics
Powerful still easy-to-use software providing tools for live image view, image capture, advance camera controls, geometrical measurements, image comparision and documentation.
Developed for Productivity and Cost Efficiency
Basic system configured with a robust high resolution optical probe and Inspectis fast 5.0MP, USB3.0 digital microscope. Deliveted with an innovative stand and background lighting system.